Thu 22 Oct 2009
InnerSense Introduces a New Diagnostics Instrument for High Volume Semiconductor Manufacturing Environment
Posted by EPR Network under Business, Computers, Electronics, Featured, Industrial, International Trade, Science, Semiconductors, Technology
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Released on: October 22, 2009, 3:36 am
Author: InnerSense Ltd.
Industry: Semiconductors
Ein Harod, ISRAEL, October 22, 2009 – InnerSense Ltd., a leading global developer and manufacturer of precision auto-diagnostics instruments for the semiconductors industry, introduced a new system for eliminating handling-related yield loss in 300mm wafer process tools running high volume production.
The new system, coined SMW2, consists of a 300mm wafer instrumented with sensitive three dimensional vibration sensors, and a “Smart FOUP™” that serves as a recharge and communication station, as well as a clean storage container. The “Smart FOUP” employs contact-less recharging and data transfer that enable the system to interface with standard robotic wafer handlers and be operated with minimal interruption to the production line.
Yigal Tomer, InnerSense’s Co-CEO, commented, “The new system is based on six years of excursion control experience. Built on our successful Smart Wafer technology, it brings to the high volume production environment the monitoring ability that has enabled predictive maintenance and statistical analysis of tool condition, previously available in engineering mode only.”
In addition to 3D vibration sensing and FOUP-based, contact-less reader/recharger station, the SMW2 features advanced analytical tools that facilitate troubleshooting, SPC-based trend identification and tool-to-tool comparison. These tools allow even untrained operators to use the system effectively to enhance the availability of expensive wafer process equipment.
